TE4008 Electronics Cooling and Packaging Syllabus:

TE4008 Electronics Cooling and Packaging Syllabus – Anna University PG Syllabus Regulation 2021

COURSE OBJECTIVES:

1. To provide a basic knowledge of the technologies and processes required for the packaging.
2. To expose the students to all aspects of electronic equipment and components including electrical, thermal, fluid dynamics and reliability issues
3. To illustrate Radiation on the surface through electronic components
4. To analyze the effect of electronics equipment at different modes
5. To provide a vision for cooling systems and its packaging devices

UNIT I INTRODUCTION

Electronic Equipment, Components of Electronic Systems, Thermal management in electronic devices – Packaging Trends. Electronic packaging and interconnection technology. Conduction in Electronic Equipment: Thermal Conductivity, Thermal Resistances, Conductivity in Solids, Conductivity in Fluids, Conduction—Steady State, Conduction in Simple Geometries, Conduction through a Plane Wall, Conduction through Cylinders and Spheres.

UNIT-II ELECTRONICS ASSISTED IN THERMAL COMPONENTS

Conduction—Transient, Lumped Capacitance Method, Conduction in Extended Surfaces. Fin Efficiency, Fin Optimization, Fin Surface Efficiency, Thermal Contact Resistance in Electronic Equipment, Discrete Heat Sources and Thermal Spreading. Fluid Dynamics for Electronic Equipment- Boundary Layer Theory, Turbulent Flow, Loss Coefficients and Dynamic Drag, Fans and Pumps, Electronic Chassis Flow.

UNIT-III IMPACT OF RADIATION ON SURFACE

Radiation Heat Transfer in Electronic Equipment, The Electromagnetic Spectrum, Radiation Equations, Stefan-Boltzmann Law, Surface Characteristics, Emittance, Emittance Factor, Emittance from Extended Surface, Absorptance, Reflectance, Specular Reflectance, Heat Transfer with Phase Change. Combined Modes of Heat Transfer for Electronic Equipment, Radiation and Convection in Parallel.

UNIT-IV ANALYSIS OF ELECTRONIC EQUIPMENT

Introduction to Thermal Design of Electronic Equipment. Analysis of Thermal Failure of Electronic Components. Analysis of Thermal Stresses and Strain, Effect of PCB Bending Stiffness on Wire Stresses, Vibration Fatigue in Lead Wires and Solder Joints. Electronics Cooling Methods in Industry. Heat Sinks, Heat Pipes, Heat Pipes in Electronics Cooling, Thermoelectric Cooling, Immersion Cooling, Cooling Techniques for High Density Electronics.

UNIT-V COOLING SYSTEMS FOR ELECTRONIC PACKAGES

Cooling systems for electronics packages – heat sinks, heat spreaders, heat pipes, microchannels, actuators, fans, cold plates; Thermo-mechanical issues in electronic packages Effects of Vibration – vibrating systems, vibration of axially loaded components, circuit boards, Theorem of Castigliano; Reliability Metrology and Analysis, Environmental Stress Screening

TOTAL 45 PERIODS

COURSE OUTCOMES:

Upon completion of this course, the students will be able to:
1. Identify the basic knowledge about the packaging of electronics
2. Utilise the ability of electronic cooling system.
3. Analyse the radiation through multi electronic devices
4. Evaluate the performance calculation of Electronics Equipment.
5. Applying cooling systems for different thermal sourcing agents

REFERENCES:

1. Rao R. Tummala : Fundamentals of Microsystem Packaging, McGraw Hill, 2001.
2. Richard K. Ulrich &William D. Brown Advanced Electronic Packaging – 2nd Edition : IEEE Press,2006.
3. Yunus A. Cengel : Heat Transfer – A Practical Approach, McGraw Hill, 2003. 4. The Electronic Packaging Handbook- Glenn R. Blackwell, 1st Edition, 2000