CM4072 Electronics Manufacturing Technology Syllabus:
CM4072 Electronics Manufacturing Technology Syllabus – Anna University PG Syllabus Regulation 2021
OBJECTIVES:
To impart knowledge on wafer preparation and PCB fabrication
To introduce Through Hole Technology (THT) and Surface Mount Technology (SMT) with various types of electronic components
To elaborate various steps in Surface Mount Technology (SMT)
To be acquainted with various testing and inspection methods of populated PCBS
To outline repair, rework and quality aspects of Electronic assemblies.
UNIT I INTRODUCTION TO ELECTRONICS MANUFACTURING
History, definition, wafer preparation by growing, machining, and polishing, diffusion, microlithography, etching and cleaning, Printed Circuit Boards, types- single sided, double sided, multi layer and flexible printed circuit board, design, materials, manufacturing, inspection. Electronic packaging – Through Hole Technology (THT) and Surface Mount Technology (SMT)
UNIT II COMPONENTS AND PACKAGING
Through-hole components – axial, radial, multi leaded, odd form. Surface mount components active, passive. Interconnections – chip to lead interconnection, die bonding, wire bonding, TAB, Flip chip, chip on board, multi chip module, direct chip array module, leaded, leadless, area array and embedded packaging, miniaturization and trends.
UNIT III SOLDERING AND CLEANING
Soldering theory, effect of elemental constituents on wetting, microstructure and soldering, solder paste technology – fluxing reactions, flux chemistry, solder powder, solder paste composition and manufacturing, solder paste rheology, Wave soldering. Adhesive and solder paste application. solder system variables. soldering temperature profile. Reflow soldering – profile generation and control, soldering quality and defects. Post solder cleaning and selection. Measurement of cleanliness levels.
UNIT IV SURFACE MOUNT TECHNOLOGY
SMT Equipment and Material Handling Systems, Handling of Components and Assemblies – Moisture Sensitivity and ESD, Safety and Precautions Needed, IPC and Other Standards, Stencil Printing Process, solder paste storage and handling, stencils and squeegees, process parameters, quality control – Component Placement, Equipment Type, Chip shooter, IC placer, Flexibility, Accuracy of Placement, Throughput, reflow soldering, adhesive, underfill and encapsulation process, applications, storage and handling, process & parameters.
UNIT V INSPECTION, TEST AND REWORK FOR PCB
Inspection Techniques, Equipment and Principle – AOI, X-ray. stencil printing process- defects & corrective action, component placement process – defects & corrective action, Reflow Soldering Process- defects & corrective action, underfill and encapsulation Process- defects & corrective action, Testing of assemblies, In-circuit testing (ICT), functional testing, concept of yield, Rework and Repair, tools, rework criteria and process, Design for – Manufacturability, Assembly, Reworkability, Testing, Reliability and Environment.
OUTCOMES:
At the end of this course, the students shall be able to:
CO1: Realize wafer preparation and PCB fabrication.
CO2: Elaborate on through hole and surface mount technology components.
CO3: Discuss the steps involved in soldering post solder cleaning and its importance in PCB manufacturing.
CO4: Improve knowledge on surface mount technology.
CO5: Locate the required inspections, testing and repair methods used in PCB.
REFERENCES
1. Coombs, Jr. C.E., “ Printed Circuits Handbook ” Mc Graw-Hill Hand books Sixth Edition, 2008
2. Gurnett, K.W., “Surface Mount Handbook”, Newnes Elsevier , 1999
3. Landers, T.L., “Electronics Manufacturing Processes”, Prentice Hall, 1998
4. Lee, N.C., “Reflow Soldering Process and Trouble Shooting – SMT, BGA, CSP and Flip Chip Technologies”, Newnes Elsevier, 2001
5. Prasad R.P., “Surface Mount Technology: Principles and Practice”, New York: Chapman and Hall, 1997.
6. Seraphim, D., Lasky, R.C. and Che-Yu Li, “Principles of Electronic Packaging” Mcgraw Hill, 1989.
7. Strauss, R.,“ SMT Soldering Handbook”, Newnes Elsevier , 1998
8. Zant, P.V., “ Microchip Fabrication – a practical guide to semiconductor processing ”McGraw Hill, 2000