CM4015 Micro Electro Mechanical Systems Syllabus:
CM4015 Micro Electro Mechanical Systems Syllabus – Anna University PG Syllabus Regulation 2021
OBJECTIVES:
To introduce MEMS, Microsystems, materials and working of MEMS and Microsystems
To explain the scaling laws in miniaturization and design for microsysytems
To familiarize with different microsystem fabrication processes.
To learn packaging, interfaces and assembly of microsystems
To gain knowledge in different measurement and characterization methods for MEMS
UNIT I INTRODUCTION
Overview of MEMS and Microsystems: MEMS and Microsystems, Evolution of Micro fabrication, Microsystems and Microelectronics, Microsystems and miniaturization-Materials for MEMS and Microsystems: substrates and wafers, active substrate materials, Silicon, Gallium Arsenide, Piezoelectric Crystals, Polymers, Packaging materials-Working principles of Microsystems: micro sensors, micro actuation, MEMS with micro actuators, Micro accelerometers, micro fluidics-Applications of Microsystems in various industries.
UNIT II MECHANICS, SCALING AND DESIGN
Engineering Mechanics for Microsystems design: Introduction, Static bending of Thin Plates, Mechanical Vibration, Thermomechanics, Thermofluid, Engineering and micro system design, Laminar fluid flow, Incompressible fluid Flow, Heat conduction in solids-Scaling Laws in Miniaturization, Introduction to scaling, Scaling in (Electrostatic forces electromagnetic forces, Electricity, fluid mechanics, heat transfer)-Microsystems Design: Design Consideration, Process design, Mechanical Design, Design of Micro fluidic Network systems
UNIT III MICRO SYSTEM FABRICATION PROCESSES
Introduction- Photolithography- Ion implantation- Chemical Vapor Deposition-Physical Vapor Deposition – clean room- Bulk micromachining :etching, isotropic and anisotropic etching, wet and dry etching Surface micro machining :process, mechanical problems associated with surface micro machining- LIGA process :general description, materials for substrates and photo resists-SLIGA process-Abrasive jet micro machining-Laser beam micro machining- Micro Electrical Discharge Micro Machining –Ultrasonic Micro Machining- Electro chemical spark micro machining- Electron beam micro machining-Focused Ion Beam machining
UNIT IV MICROSYSTEMS PACKAGING
Introduction – Microsystems Packaging-Interfaces in Microsystems Packaging-Essential Packaging Technologies- Die preparation, surface bonding, wire bonding, sealing- Three dimensional Packaging Assembly of Microsystems, Signal Mapping and Transduction
UNIT V MICROMETROLOGY AND CHARACTERIZATION
Microscopy and visualization- Lateral and vertical dimension- optical microscopy, Scanning white light interferometry, Confocal Laser scanning microscopy, Molecular measuring machine, Micro coordinate measuring machine- Electrical measurements – Physical and chemical analysis – XRD- SEM – Secondary Ion mass spectrometry- Auger Electron Spectroscopy, SPM
OUTCOME:
CO1: Explain the concept of Micro Electro Mechanical systems
CO2: Develop micro system design
CO3: Identify the elements of MEMS system
CO4: Determine the scaling and design methods
CO5: Examine the micro metrology and characterization
REFERENCES
1. Franssila, S., “Introduction to Micro Fabrication” John Wiley & sons Ltd, 2004.ISBN:470-85106-6
2. Hak M.G., “MEMS Handbook”, CRC Press, ISBN: 8493-9138-5, 2006.
3. Hsu, T.R., “MEMS & Microsystems Design and Manufacture”, Tata McGraw Hill, 2002,ISBN: 9780070487093.
4. Jackson, M.J., “Microfabrication and Nanomanufacturing” Second edition,Taylor and Francis 2008.
5. Jain, V.K., “Introduction to Micromachining”Second edition, Narosa Publishing House, 2018.
6. McGeough, J.A., “Micromachining of Engineering Materials”, CRC Press, ISBN: 0824706447, 2001.