AP4005 Micro Electro Mechanical Systems Syllabus:

AP4005 Micro Electro Mechanical Systems Syllabus – Anna University PG Syllabus Regulation 2021

COURSE OBJECTIVES:

 To understand the operation of sensors and actuators
 To understand the operation of major classes of MEMS devices/systems
 To give the fundamentals of standard micro fabrication techniques and processes
 To understand the unique demands, environments and applications of MEMS devices
 To understand RF MEMS, Bio MEMS and MOEMS

UNIT I INTRODUCTION TO MEMS

Intrinsic Characteristics of MEMS – Energy Domains and Transducers- Sensors and Actuators – Introduction to Micro fabrication – Silicon based MEMS processes – New Materials – Review of Electrical and Mechanical concepts in MEMS – Semiconductor devices – Stress and strain analysis – Flexural beam bending- Torsional deflection.

UNIT II SENSORS AND ACTUATORS

Electrostatic sensors – Parallel plate capacitors – Applications – Interdigitated Finger capacitor Piezoresistive sensors – Piezoresistive sensor materials – piezoelectric effects – piezoelectric materials-Stress analysis of mechanical elements – Thermal Sensing and Actuation – Thermal expansion – Thermal couples – Thermal resistors – Thermal Bimorph – Applications – Magnetic Actuators – Micromagnetic components.

UNIT III MICROMACHINING

Silicon Anisotropic Etching – Anisotrophic Wet Etching – Dry Etching of Silicon – Plasma Etching – Deep Reaction Ion Etching (DRIE) – Isotropic Wet Etching – Gas Phase Etchants – Case studies –Basic surface micro machining processes – Structural and Sacrificial Materials – Acceleration of sacrificial Etch – Striction and Antistriction methods – LIGA Process – Assembly of 3D MEMS – Foundry process.

UNIT IV POLYMER AND OPTICAL MEMS

Polymers in MEMS – SU-8, PMMA, PDMS, Langmuir – Blodgett Films, Micro System fabrication – Photolithography – Ion implantation- Diffusion – Oxidation – Chemical vapour deposition – Etching- Optical MEMS – Lenses and Mirrors – Actuators for Active Optical MEMS.

UNIT V OVERVIEW OF MEMS AREAS

Bonding techniques for MEMS : Surface bonding , Anodic bonding , Silicon – on – Insulator , wire bonding , Sealing – Assembly of micro systems- RF MEMS – switches, active and passive components, Bio MEMS – Microfluidics, Digital Micro fluidics, Ink jet printer,- MOEMS – optical switch, optical cross-connect, tunable VCSEL, micro bolometers.

TOTAL : 45 PERIODS

SUGGESTED ACTIVITIES:

1. Expose the students to occupational environment related to semiconductor devices and MEMS
2. Create opportunity for acquiring practical skills of various field instruments in the area of MEMS devices
3. Manage the issues arising during the execution of projects related to MEMS.

COURSE OUTCOMES:

At the end of the course the student will be able to:
CO1: Understand the working principles of micro sensors and actuators
CO2: Understand the application of scaling laws in the design of micro systems
CO3: Understand the typical materials used for fabrication of micro machines
CO4: Understand the principles of standard micro fabrication techniques
CO5: Appreciate the challenges in the design and fabrication of RF,Bio, and MOEMS systems

REFERENCES

1. Stephen D Senturia, ‘Microsystem Design’, Springer Publication, 2000.
2. Chang Liu, ‘Foundations of MEMS’, Pearson Education Inc., 2012.
3. Marc J. Madou, ‘Fundamentals of Microfabrication: The Science of Miniaturization’, Second Edition , 2002.
4. Nadim Maluf,“ An Introduction to Micro Electro Mechanical System Design”, Artech House, 2000.
5. Mohamed Gad-el-Hak, editor, “ The MEMS Handbook”, CRC press Baco Raton, 2001.